Silica sol is used in crystal polishing

In the polishing process of semiconductor wafers, the polishing time is short, and the polishing rate is required to be fast, the surface quality is good, and the impurities are less, so as to avoid affecting the performance and yield of power devices. The particle size distribution of silica sol is uniform, there are many effective particles for grinding, and the polishing rate is fast; the hardness is moderate, the dispersion and fluidity are good, and it is not easy to precipitate and agglomerate to cause wafer scratches; at the same time, the silica sol has high purity, low residue, and is easy to grind. Cleaning reduces the impact of wafer surface contamination.