YM NANO SILICA

Electronics & Semiconductor Industry

This field demands high purity to prevent metal ion contamination.

1. Chemical Mechanical Polishing (CMP)

   · Common Type: Alkaline (pH 9-11), Ammonium-stabilized.

   · Solid Content: 30% - 50% (High concentration improves polishing efficiency).

   · Particle Size: 10-150 nm.

    · Function & Principle: Acts as a polishing abrasive. Through the synergistic effect of mechanical friction and chemical corrosion in an alkaline environment, it achieves atom-level planarization.

2. Lead-Acid Battery Gelled Electrolyte

   · Common Type: Acidic or Weakly Alkaline.

   · Solid Content: 15% - 30% (Requires dilution before use).

   · Particle Size: 10-15 nm.

   · Function & Principle: Forms a thixotropic gel structure to immobilize the electrolyte, preventing acid stratification and leakage.